China Ubushushu obuPhakamileyo obuBomvu Masking ukutshiza Ipeyinti Tape umzi-mveliso kunye nabavelisi |Newera

Ubushushu obuphakamileyo obuBomvu beMasking Spray Tape yePeyinti

Ubushushu obuphakamileyo obuBomvu beMasking Spray Ipeyinti yeTape eFakelweyo Umfanekiso

inkcazelo emfutshane:

I-tape yokushisa ephezulu yokushisa isekelwe kwiphepha le-masking high-grade njengesiseko sezinto eziphathekayo kunye ne-adhesive adhesive silicone, eneempawu zokumelana nokushisa okuphezulu, ukuchasana kwe-solvent, kwaye akukho glue ephuphumayo.Isetyenziswa ikakhulu ukupeyinta, ipeyinti yokubhaka, iibhodi zePC, iibhodi zesekethe, kunye neebhodi zesekethe., iiteyiphu ze-solder capacitor, iikhoyili, iziguquli, njl.

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Iinkcukacha zeMveliso

Iithegi zeMveliso

Uphawu

Umphezulu oncamatheleyo unemigca emide kwaye uncangathi.Ukumelana nobushushu obuphezulu obugqwesileyo, akukho ntsalela yokuncamathelayo emva kokuxebuka kobushushu obuphezulu.
I-tape yokufihla iqondo lokushisa eliphezulu ineempawu zokukrazula lula, ukubambelela kakuhle, ukumelana nobushushu obuhlukeneyo, akukho ntsalela yeglue, ukunamathela okuphezulu, ukuguquguquka okuhle, ukususwa ngokulula, kwaye akukho ngcoliseko.Ngokweempawu zephepha kunye nokuqulunqwa kwenkqubo yokubambelela, isetyenziswa ngokubanzi kumashishini ahlukeneyo.
Ngaphezu koko, i-adhesive eyenziwe ngokukodwa yokunyanga yobushushu obuphezulu be-masking tape ibonelela ngokugqwesileyo kokuxhathisa kunye nokumelana nobushushu obuphezulu ngaphandle kokushiya naziphi na iimpawu zeglue.
Ukusetyenziswa kwiqondo lokushisa, elilungele ukuhombisa, ukupeyinta, ukupeyinta, ukwahlula umbala, ukupeyinta kunye nokukhuselwa kwezakhiwo zorhwebo zasekuhlaleni kunye namashishini e-elektroniki.

Injongo

1. Kufanelekile ukutshiza ukushisa okuphezulu kunye nokukhusela ukukhusela iimeko zekhompyutheni kunye neekhabhinethi;
2. Ibhodi yesekethe eprintiweyo (PCB) isetyenziselwa ukukhusela inxalenye yomnwe wegolide kunye nokuthintela ukuntywiliselwa kunye nokungcoliswa kwesisombululo se-electroplating ngexesha lesithando somlilo se-tin kunye nenkqubo ye-wave soldering yebhodi yesekethe eprintiweyo (PCB).
3. Isetyenziselwa ukuncamathelisa ibhodi yesekethe eguquguqukayo (FPC) kwi-fixture, ukwenzela ukuba kuqhutywe ukuprinta, ukupakisha, ukuvavanya, kunye nebhodi yesekethe ye-electroplating.
4. Ukupeyinta kunye nokugquma ukusetyenziswa kwePU (izihlangu ezinogwebu)/PVC yodwa yokutshiza kunye nepeyinti yokubhaka kwiifektri zemathiriyeli yezihlangu.