Ixabiso eliLungileyo ngokweMibala yokupeyinta ngokweSiko abapeyinti ngexabiso eliphantsi lokuMasking tape 80 lobushushu obusekwe kwiTape yokuMasking yeRabha
Yintoni iitheyiphu yokufihla?
Iteyiphu yokufihlangumhombiso wobugcisa obuphezulu kunye nephepha lokutshiza (elikwabizwa ngokuba liphepha lokwahlula umbala ngenxa yeempawu zalo ezikhethekileyo), elisetyenziswa kakhulu ekuhombiseni kwangaphakathi, ukupeyinta ukutshiza kwezixhobo zendlu kunye nokutshiza iimoto zodidi oluphezulu.Umphumo wayo wokwahlula umbala unemida ecacileyo kunye ecacileyo, kwaye nayo inefuthe lobugcisa be-arc, obuzisa inguqu entsha yezobuchwepheshe kwimboni yokuhombisa kunye nokutshiza, kwaye yenza ukuba ishishini likhanyise ngamandla amatsha.
Inkqubo yemveliso yeitheyiphu yokufihla:
Iimpawu zokufihla iteyiphu:
1.Iteyiphu yokufihlayiteyiphu yokuzincamathela esekwe kwiphepha lecrepe elifakwe intlaka.Ukutywinwa kunye nokupakishwa.Masking ngexesha lokupeyinta, ukugquma kunye nokuqhunyiswa kwesanti.Ukulungiswa kwezixhobo ze-elektroniki kunye neengcingo.
2. Ukubunjwa okukhethekileyo kwe-adhesive yokunyanga kunika ukuchasana kwe-solvent kunye nokumelana nokushisa okuphezulu, kwaye akushiyi nayiphi na imikhondo yokubambelela.
3. I-tape inokugoba ngokulula kwi-curve, kwaye umgca wokukhusela wesangqa awuyi kuphulwa.
4. Ukugcinwa kwamandla okugcinwa kwe-tape ngokwayo kunokubonelela ngokufanelekileyo ukugcinwa kwamandla naphantsi koxinzelelo olunzima.
5. Kulula ukukrazula, kulula ukusebenza Nangaphandle kwesikere okanye iiblades, isenokusetyenziswa.
6. Ukuthobela I-tape ingasetyenziselwa ebusweni be-curvature ephezulu, kwaye ubukhulu buyanele ngaphandle kokuxhaswa.
7. Umoya ophakathi wokuvula amandla Amandla akhululayo angenzima kakhulu okanye alula kakhulu kulula ukusebenza.
8. Ubumnandi I-tape substrate igudile kwaye ayiyi kubangela ukuba ulusu lomsebenzisi luzive lunzima.
9. Akukho lula ukuqhekeza kwiiqhekeza I-tape ayiyi kwahlula ngokuzenzekelayo ibe ngamaqhekeza amaninzi.
10. Ukunamathela ngokukhawuleza I-tape inamathele ngokukhawuleza nje ukuba ichukumise.
11. I-solvent resistance I-Crepe paper substrate iyaxhathisa ekungeneni kwe-solvent.
12. Umbala osisiseko awuyi kuwa
Ukusetyenziswa kweteyiphu yokuMasking:
Isetyenziselwa ukugquma kunye nokugubungela umhlobiso, ukupeyinta, ukubhaka ivanishi, njl., kunye nokulungiswa kwamacandelo e-semiconductor.Umdibanisoitheyiphu yokufihlaInamandla anamandla okuxobula, ukunamathela okugqwesileyo kunye nokuncamathela kokuqala, ukuxhathisa kweasidi kunye nealkali, ukungafihli, kunye nokumelana nobushushu ukuya kuthi ga kuma-230 degrees ukuya kuma-260 degrees.umsebenzi kunye nobushushu obuphezulu bokutshiza ngomgubo.
Ulwahlulo lwetape yokufihla :
Ngokutsho kwe-viscosity eyahlukeneyo, inokwahlulwa ibe:tape yokufihla i-viscosity ephantsi, i-medium-viscosity masking tape, i-high-viscosity masking tape.
Ngokwezixhobo ezahlukeneyo, inokwahlulwa ibe:itheyiphu yokufihla eqhelekileyo, iteyiphu yokufihla edibeneyo.
Ngokutsho kobushushu obahlukeneyo, inokwahlulwa ibe:itheyiphu yokufihla ubushushu obuphantsi, iteyiphu yokufihla ubushushu obuphezulu.
Ulwazi lwenkampani: